关于温度检测的论文

the "System on a Chip"Much has been written about the concept of a "system on a chip," the ever-increasing integration of logic and analog functions on one silicon die or chip. This paradigm is about to change. The results of work by universities, national labs, and companies such as Motorola, Inc., are paving the way for a true system on a chip, or SOC. These new SOCs will not only analyze data, but will measure, analyze, and react to their integration of power and analog elements with a CMOS microcontroller unit (MCU) has been possible for several years. Products have been introduced such as an integrated 68HC05 motor controller with integral power devices in an H-bridge configuration (1990). In 1993, a product called a System Chip MCU was introduced that provided a Society of Automotive Engineers J1850 interface, including the physical layer. This chip could withstand 40 V, based on the combination of power and analog capability with the MCU. However, the system input was not included in previous monolithic is the most recent development that promises to truly enable a system on a chip? It is the ability to combine CMOS and MEMS (microelectromechanical systems) structures into one process flow. Photo 1 illustrates a 68HC05 microcontroller with a 100 kPa pressure sensor integrated onto a single silicon die. A likely application is a side air bag pressure sensor, inside the door panel of a car, could detect the change in pressure when the panel crumples under an impact. The ability to program the onchip microcontroller will enable the auto manufacturer to embed the control algorithm inside the chip. To complete an entire system, only a mechanism for actuating the air bag need be added. This actuation capability could be yet another step in the continuous integration of silicon and electronics/electromechanical systems. This platform provides a first step in the integration of electronics with electromechanical structures and at the same time raises several issues that must be resolved before a low-cost, high-quality product can be mass produced. One of these issues is that of logic circuits have many years of accumulated test data that can be used as a foundation for building the next generation of product. With sensors, however, very little previous technology can be reused. The reasons are the relative infancy of sensor technology and the uniqueness of each type of sensor. For example, the technology used to measure pressure (a thin diaphragm with integral strain gauge) is much different from that used for measuring acceleration (a proof mass forming a moving capacitor). The testing technology is different as well. Pressure measurements require a pressure source to be connected to the sensor; acceleration or shock detection requires shaking the device at some known frequency and ConfigurationTo develop a proof-of-concept vehicle (see Figure 1), a 100 kPa pressure sensor was integrated onto Motorola's standard 8-bit 68HC05 microcontroller core along with the associated analog circuitry [1]. To this basic core was added analog circuitry for signal conditioning, a voltage and current regulator, and 10-bit A/D and 8-bit D/A converters. A temperature sensor was also incorporated into the design for compensation pressure transducer is temperature dependent and has an inherent nonlinearity. To increase the accuracy of the system, a calibration or conditioning algorithm must be programmed into the pressure transducer's output is conditioned by a variable gain and input offset amplifier that is controlled by the program stored in the MCU. The A/D converter is used to read the temperature sensor's and the pressure transducer's outputs. The band gap voltage regulator supplies a constant voltage for the pressure sensor, amplifier, and A/D converter. The band gap current regulator provides a constant current source for the temperature MethodThe MCU calibrates and compensates the pressure sensor's nonlinearity and temperature drift. To provide the maximum accuracy, an A/D input resolution of 10 bits was chosen and the calculation resolution was set at 16 bits, fixed point. To calibrate span and offset and compensate the nonlinearity of the sensor output, calibration software performs a second-order polynomial correction of sensor output described as:Vout = c0 + c1Vp + c2Vp2 (1)Cp = (c0, c1, c2 ) (2)where:Vout = calibrated outputVp = uncompensated pressure sensor outputTo compensate the temperature dependency of Cp, calibration software is used to calculate Cp using a second-order polynomial fitting equation to temperature:c0 = c00 + c01Vt + c02 Vt2 (3)c1 = c10 + c11Vt + c12 Vt2 (4)c2 = c20 + c21Vt + c22Vt2 (5)(6)where:Vt = temperature sensor outputThe Cts are read during the calibration procedure and stored in EPROM. The MCU calculates Cp from the temperature sensor output, Vt, and Ct. Cp is then used to calculate the calibrated pressure sensor output using the pressure transducer's output, ProcedureThe calibration system first adjusts the gain and offset of the amplifier to use the full A/D range. Then the characteristics of the uncompensated pressure sensor output are examined over several temperature points. At each temperature, a second-order polynomial described in Equation 1 is obtained by least square fitting and the coefficient set, Cp, is determined. After completing the calculation of Cp over all temperature points, Ct is determined by the least square fitting of Equations 3, 4, and 5 to determine Cp over the temperature points. At present, at least three separate temperature sampling points are required to complete the fitting 2. The uncompensated output of the sensor-based system on a chip is plotted at four different 2 shows the uncompensated sensor output characteristics over various temperatures after adjusting gain and offset. Based on these data, the coefficients for calibration were calculated and written into the onchip EPROM by the calibration system. The compensation value was rounded off to 8 bits. Figure 3 shows the calibrated and compensated output of the integrated MCU. Figure 4 shows the error from expected values. Since 1 bit is error, the result indicates the error is within of full-scale 3. Compensated output of the system on a chip is improved through testing and calibration at three IssuesSeveral issues are raised by this initial work, including the different types of testing required, unique test equipment, and the need for multipass testing. To make a low-cost integrated solution possible, these concerns must be integration of a physical measurement function onto the already complex mixed-mode analog-digital chip raises the need for an additional type of testing. The physical medium being tested must be applied to the device and the response must be measured. Measuring the response to a physical stimulus is not aFigure 4. Bit error in the compensated output is within 1 bit at both 30°C and 85°Cstandard test for the semiconductor industry, especially under multiple temperatures. Standard equipment can test the digital and analog portions of the chip, but the application of a physical stimulus and the procedure of heating and cooling the device under test rapidly and accurately drive the need for a modified and unique tester. These testers are one of a kind and are not available as a standard. The tester therefore represents a large part of the final unit's only are the testers expensive, but the throughput is limited. This raises the cost of each part because of the increased depreciation costs allocated to each device. The cost is further increased by the need for multipass testing. Remember that each part is first tested, using at least three different temperatures, to determine the transducer's output characteristics over temperature. Then these values are used to derive the compensation algorithm, which is loaded into the onchip EPROM. To complete the cycle, the device is once again tested over temperature to prove accuracy. Hence, not only is a special tester required, but it becomes a bottleneck since it must be used twice to complete each device—once to measure the characteristics and a second time to verify the DirectionsFinding ways to reduce the cost of testing is one of the keys to making a low-cost integrated sensor and MCU a reality. Ideas that could prove promising include:Thoroughly characterizing the designLimiting the operating temperatureLimiting the accuracyProgramming the MCU to take data during testingLoading the test and compensation algorithm into the MCU before testingSince this is a first proof-of-concept device, further characterization could provide a way to limit the number of temperatures required for compensations. Limiting the operating temperature range could also reduce the number of temperatures required for compensation testing. Data shown in Figure 3 indicate a 5% accuracy from 5°C to 25°C. Another potential cost reduction step would be to use the MCU's programmability for data logging during test. By storing the compensation program in the onchip EPROM prior to test, and then logging the uncompensated output into the EPROM during test, it might be possible to develop an algorithm for a one-pass test over a breakthrough in lowering the cost of testing this new integrated sensor and MCU, the system designer may be limited to the continued use of the present day solution—separate MCU and the DS18B20 sensors, used for the multipoint test temperature, are connected with MCU on one of IO bus, and temperature data are collected by turns. If the system has a large amount of sensors, the time of MCU used in processing the temperature data is obviously prolonged, so the cycle of alternate test gets longer. In this paper, a new method that DS18B20 are rationally grouped is presented, and some measures are taken in software; as a result, the speed of alternate test advances

温度传感器原理及应用论文参考文献

温度传感器原理及应用论文参考文献，温度传感器是温度测量仪表的核心部分，是指能感受温度并转换成可用输出信号的传感器，品种繁多，也是用处比较广的工具。以下分享温度传感器原理及应用论文参考文献。

一、温度传感器工作原理–恒温器

恒温器是一种接触式温度传感器，由两种不同金属（如铝、铜、镍或钨）组成的双金属条组成。

两种金属的线性膨胀系数的差异导致它们在受热时产生机械弯曲运动。

一、温度传感器工作原理–双金属恒温器

恒温器由两种热度不同的金属背靠背粘在一起组成。当天气寒冷时，触点闭合，电流通过恒温器。当它变热时，一种金属比另一种金属膨胀得更多，粘合的双金属条向上（或向下）弯曲，打开触点，防止电流流动。

有两种主要类型的双金属条，主要基于它们在受到温度变化时的运动。有在设定温度点对电触点产生瞬时“开/关”或“关/开”类型动作的“速动”类型，以及逐渐改变其位置的较慢“蠕变”类型随着温度的变化。

速动型恒温器通常用于我们家中，用于控制烤箱、熨斗、浸入式热水箱的温度设定点，也可以在墙上找到它们来控制家庭供暖系统。

爬行器类型通常由双金属线圈或螺旋组成，随着温度的变化缓慢展开或盘绕。一般来说，爬行型双金属条对温度变化比标准的按扣开/关类型更敏感，因为条更长更薄，非常适合用于温度计和表盘等。

二、温度传感器工作原理–热敏电阻

热敏电阻通常由陶瓷材料制成，例如镀在玻璃中的镍、锰或钴的氧化物，这使得它们很容易损坏。与速动类型相比，它们的主要优势在于它们对温度、准确性和可重复性的任何变化的响应速度。

大多数热敏电阻具有负温度系数（NTC），这意味着它们的电阻随着温度的升高而降低。但是，有一些热敏电阻具有正温度系数 (PTC)，并且它们的电阻随着温度的升高而增加。

热敏电阻的额定值取决于它们在室温下的电阻值（通常为 25 o C）、它们的时间常数（对温度变化作出反应的时间）以及它们相对于流过它们的电流的额定功率。与电阻一样，热敏电阻在室温下的电阻值从 10 兆欧到几欧姆不等，但出于传感目的，通常使用以千欧为单位的那些类型。

温度传感器类毕业论文文献有哪些？

1、[期刊论文]一种高稳定性双端出纤型光纤光栅温度传感器

期刊：《声学与电子工程》 | 2021 年第 002 期

摘要：针对双端出纤型光纤光栅温度传感器线性度较差、温度测量精度低的问题,文章首先对传感器内部结构进行了优化,使光纤光栅在整个温度测量区间内不受结构件热胀冷缩的应力影响,从而提升传感器的稳定性、实验验证,采用新工艺封装的.光纤光栅温度传感器在5～65°C的范围内温度精度达到0、1°C,且重复性良好,适用于自然环境下的温度传感、

关键词：光纤光栅；温度传感器；应力；测温精度

链接：、zhangqiaokeyan、com/academic-journal-cn_acoustics-electronics-engineering_thesis/0201290086379、html

2、[期刊论文]某型温度传感器防护套弯折疲劳试验的寿命研究

期刊：《环境技术》 | 2021 年第 001 期

摘要：由于动车组轴端温度传感器的大多数已达到三级修、四级修的修程,检修的数量和成本逐年增加,检修发现出现防护套破损的情况较多,需要大量更换,本文通过对温度传感器的防护套进行弯折疲劳试验,对数据结果进行统计分析,确认导致防护套弯折老化的主要原因、

关键词：防护套；破损；弯折疲劳

链接：、zhangqiaokeyan、com/academic-journal-cn_environmental-technology_thesis/0201288850019、html

3、[期刊论文]进气压力温度传感器锡晶须的分析

期刊：《机械制造》 | 2021 年第 004 期

摘要：对进气压力温度传感器的结构进行了介绍,对进气压力温度传感器产生锡晶须问题进行了分析,并在分析锡晶须生长机理的基础上提出了抑制方法、

关键词：传感器；锡晶须；分析

链接：、zhangqiaokeyan、com/academic-journal-cn_machinery_thesis/0201288850874、html

4、[期刊论文]一种具有±0、5℃精度的CMOS数字温度传感器

期刊：《电子设计工程》 | 2021 年第 001 期

摘要：该文设计了一种基于0、35μm CMOS工艺的采用双极型晶体管作为感温元件的数字温度传感器、该温度传感器主要由正温度系数电流产生电路、负温度系数电流产生电路、一阶连续时间Σ-Δ调制器、计数器和I2C总线接口等模块组成、为提高温度传感器的测量精度

该文深入分析了在不采用校准技术的情况下工艺漂移对温度传感器精度的影响,并在此基础上提出了简单的校准电路设计、根据电路仿真结果,在加入校准电路之后,温度传感器在-40～120℃温度范围内的精度可以达到±0、5℃、

关键词：数字温度传感器；CMOS工艺；双极型晶体管；校准

链接：、zhangqiaokeyan、com/academic-journal-cn_electronic-design-engineering_thesis/0201286451032、html

5、[期刊论文]柴油机冷却水温度传感器断裂故障分析

期刊：《内燃机与配件》 | 2021 年第 004 期

摘要：针对柴油机冷却水温度传感器断裂的问题,通过对该测点管路流腔进行CFD仿真计算,分析了流腔内部速度和压力场的变化情况,确定了传感器的断裂原因。计算结果表明:传感器位置处流速较大,导致传感器下部受振荡力,且发生了空蚀,使传感器失效。

本文针对此次传感器断裂故障提出了解决措施:对传感器的位置进行了优化布置;对传感器的结构形式进行了改进。通过改进,传感器随整机验证时间超过1500h,未再发生同类断裂故障,保证了柴油机的安全运行,为以后类似故障的分析和解决提供参考。

关键词：柴油机；温度传感器；流速；受力

链接：、zhangqiaokeyan、com/academic-journal-cn_internal-combustion-engine-parts_thesis/0201288594662、html

常见温度传感器

温度是与人类生活息息相关的物理量，在工业生产自动化流程中，温度测量点要占全部测量点的一半左右。它不仅和我们的生活环境密切相关，在科研及生产过程中，温度的变化对实验及生产的结果至关重要，所以温度传感器应用相当广泛。

温度传感器对温度敏感具有可重复性和规律性，是利用一些金属、半导体等材料与温度相关的特性制成的。现在来介绍一些温度传感器的工作原理。

铂容易提纯，其物理、化学性能在高温和氧化介质中非常稳定。铂电阻的输入－输出特性接近线性，且测量精度高，所以它能用作工业测温元件，还能作为温度计作基准器。

铂电阻在常用的热电阻中准确度最高，国际温标ITS-90中还规定，将具有特殊构造的铂电阻作为℃～℃标准温度计来使用。铂电阻广泛用于-200℃～850℃范围内的温度测量，工业中通常在600℃以下。

PN结温度传感器是利用PN结的结电压随温度成近似线性变化这一特性实现对温度的检测、控制和补偿等功能。实验表明，在一定的电流模式下，PN结的正向电压与温度之间具有很好的线性关系。

根据PN结理论，对于理想二极管，只要正向电压UF大于几个kbT/e(kb为波尔兹曼常数，e为电子电荷)。其正向电流IF与正向电压UF和温度T之间的关系可表示为

由半导体理论可知，对于实际二极管，只要它们工作的PN结空间电荷区中的复合电流和表面漏电流可以忽略，而又未发生大注入效应的电压和温度范围内，其特性与上述理想二极管是相符合的[6]。实验表明，对于砷化镓、

锗和硅二极管，在一个相当宽的温度范围内，其正向电压与温度之间的关系与式(1-3)是一致的，如图1-1所示。

实验发现晶体管发射结上的正向电压随温度的上升而近似线性下降，这种特性与二极管十分相似，但晶体管表现出比二极管更好的线性和互换性。

二极管的温度特性只对扩散电流成立，但实际二极管的正向电流除扩散电流成分外，还包括空间电荷区中的复合电流和表面漏电流成分。这两种电流与温度的关系不同于扩散电流与温度的关系，因此，实际二极管的电压—温度特性是偏离理想情况的。

由于三极管在发射结正向偏置条件下，虽然发射结也包括上述三种电流成分，但是只有其中的扩散电流成分能够到达集电极形成集电极电流，而另外两种电流成分则作为基极电流漏掉，并不到达集电极。因此，晶体管的

所以表现出更好的电压－温ICUBE关系比管的IFUF关系更符合理想情况，

度线性关系。根据晶体管的有关理论可以证明，NPN晶体管的基极—发射极电压UBE与温度T和集电极电流Ic的函数关系式与二极管的UF与T和IF函数关系式(1-3)相同。因此，在集电极电流Ic恒定条件下，晶体管的基极—发射极电压UBE与温度T呈线性关系。但严格地说，这种线性关系是不完全的，因为关系式中存在非线性项。

集成温度传感器是将温敏晶体管及其辅助电路集成在同一芯片的集成化温度传感器。这种传感器的优点是直接给出正比于绝对温度的理想的线性输出[7]。目前，集成温度传感器已广泛用于-50℃～+150℃温度范围内的温度检测、控制和补偿等。集成温度传感器按输出形式可分为电压型和电流型两种。

进气温度传感器工作原理是什么？

进气温度传感器的工作原理是：进气温度传感器在工作状态下，内部安装了一个具有负温度电阻系数的热敏电阻，通过这个负温度热敏电阻感知温度变化，进而调节电阻的大小改变电路电压。

以下是关于进气温度传感器的详细介绍：

1、原理：进气温度传感器就是一个负温度系数的热敏电阻，当温度升高的时候电阻阻值会变小，当温度降低的时候电阻值会增大，汽车的电压会随着汽车电路中电阻的变化而变化，从而产生不一样的电压信号，可以完成汽车控制系统的自动操作。

2、作用：汽车的进气温度传感器就是检测汽车发动机的进气温度，将进气温度转变为电压信号输入为ecu作为喷油修正的信号使用。

摘要本设计的温度测量计加热控制系统以AT89S52单片机为核心部件，外加温度采集电路、键盘显示电路、加热控制电路和越限报警等电路。采用单总线型数字式的温度传感器DSI8B20，及行列式键盘和动态显示的方式，以容易控制的固态继电器作加热控制的开关器件。本作品既可以对当前温度进行实时显示又可以对温度进行控制，以使达到用户需要的温度，并使其恒定再这一温度。人性化的行列式键盘设计使设置温度简单快速，两位整数一位小数的显示方式具有更高的显示精度。建立在模糊控制理论控制上的控制算法，是控制精度完全能满足一般社会生产的要求。通过对系统软件和硬件设计的合理规划，发挥单片机自身集成众多系统及功能单元的优势，再不减少功能的前提下有效的降低了硬件的成本，系统操控更简便。实验证明该温控系统能达到℃的静态误差，℃的控制精度，以及只有％的超调量，因本设计具有很高的可靠性和稳定性。关键词：单片机 恒温控制 模糊控制引言温度是工业控制中主要的被控参数之一，特别是在冶金、化工、建材、食品、机械、石油等工业中，具有举足重轻的作用。随着电子技术和微型计算机的迅速发展，微机测量和控制技术得到了迅速的发展和广泛的应用。 采用单片机来对温度进行控制，不仅具有控制方便、组态简单和灵活性大等优点，而且可以大幅度提高被控温度的技术指标，从而能够大大提高产品的质量和数量。MSP430系列单片机具有处理能强、运行速度快、功耗低等优点，应用在温度测量与控制方面，控制简单方便，测量范围广，精度较高。温度传感器将温度信息变换为模拟电压信号后，将电压信号放大到单片机可以处理的范围内，经过低通滤波，滤掉干扰信号送入单片机。在单片机中对信号进行采样，为进一步提高测量精度，采样后对信号再进行数字滤波。单片机将检测到的温度信息与设定值进行比较，如果不相符，数字调节程序根据给定值与测得值的差值按PID控制算法设计控制量，触发程序根据控制量控制执行单元。如果检测值高于设定值，则启动制冷系统，降低环境温度；如果检测值低于设定值，则启动加热系统，提高环境温度，达到控制温度的目的。图形点阵式液晶可显示用户自定义的任意符号和图形,并可卷动显示,它作为便携式单片机系统人机交互界面的重要组成部分被广泛应用于实时检测和显示的仪器仪表中。支持汉字显示的图形点阵液晶在现代单片机应用系统中是一种十分常用的显示设备,汉字BP机、手机上的显示屏就是图形点阵液晶。它与行列式小键盘组成了现代单片机应用系统中最常用的人机交互界面。本文设计了一种基于MSP430单片机的温度测量和控制装置，能对环境温度进行测量，并能根据温度给定值给出调节量，控制执行机构，实现调节环境温度的目的。━、硬件设计1：MSP430系列单片机简介及选型单片机即微控制器，自其开发以来，取得了飞速的发展。单片机控制系统在工业、交通、医疗等领域的应用越来越广泛，在单片机未开发之前，电子产品只能由复杂的模拟电路来实现，不仅体积大，成本高，长期使用后元件老化，控制精度大大降低，单片机开发以后，控制系统变为智能化了，只需要在单片机外围接一点简单的接口电路，核心部分只是由人为的写入程序来完成。这样产品体积变小了，成本也降低了，长期使用也不会担心精度达不到了。特别是嵌入式技术的发展，必将为单片机的发展提供更广阔的发展空间，近年来，由于超低功耗技术的开发，又出现了低功耗单片机，如MSP430系列、ZK系列等，其中的MSP430系列单片机是美国德州仪器（TI）的一种16位超低功耗单片机，该单片机