processes期刊投稿多久

Journal of Environmental Monitoring这个期刊已经改名为Environmental Science: Processes & Impacts [ISSN：2050-7887]，属于sci收录参考：期刊名 journal of environmental monitoring 出版周期: 中科院杂志分区 分析化学分类下的 3 区期刊 近四年影响因子:2013年度 2012年度 2011年度 2010年度 2.109 2.085 1.991 1.81 Journal of environmental monitoring [ISSN：1464-0325] 本刊收录在： MEDLINE(2011年) 本刊收录在Web of Science： SCIE(2009版) 本刊收录在Web of Science： SCIE(2012版) 主题分类： Earth Sciences: Environmental Geology Earth Sciences: Meteorology Engineering: Environmental Engineering Environmental Sciences: General and Others Law: Environmental Law & Policy Physics: Atmospheric Physics 被继承: Environmental Science: Processes & Impacts [2050-7887]

期刊名microelectronicsjournal出版周期:月刊微电子方向，这期刊不错了，underreview看你审稿人快否，一般1~3个月都有可能。出版社或管理机构杂志由ELSEVIERSCILTD出版或管理。ISSN号：0026-2692杂志简介/稿件收录要求Publishedsince1969,MicroelectronicsJournalisaninternationalforumforthedisseminationofresearchinto,andapplicationsof,microelectronics.PaperspublishedinMicroelectronicsJournalhaveundergonepeerreviewtoensureoriginality,relevanceandtimeliness.Thejournalthusprovidesaworldwide,regularandcomprehensiveupdateonsemiconductortechnology.CoverageofthejournalfallsintothetwomaincategoriesofCircuitsandSystemsandPhysicsandDevices.Thejournalinvitesresearchandapplicationpapersinalltheareaslistedbelow.Papersfeaturingnovelsystemdesignsordevicesareespeciallywelcomed.Thejournalalsoconsiderscomprehensivereview/surveypaperscoveringrecentdevelopments.Thejournal'scoverageincludes,butisnotlimitedto:CircuitsandSystemsAnalogue,digitalandRFcircuitdesignmethodologiesLogic,architecturalandsystemlevelsynthesisTesting,designfortestability,builtinself-testArea,powerandthermalevaluationCo-design,includinghardware-softwareandchip-packageMixed-domainsimulationanddesignFormalverificationApplicationaspectssuchassignalandimageprocessing,sensorandactuatordesign,reliabilityandqualityissues,andeconomicmodels,arealsowelcome.PhysicsandDevicesMaterialsgrowthscience:technologyandtechniquesPhysics,propertiesandcharacterisationofmaterialssystemsDevicesandmicrosystemstechnology:productionandmanufacturingAdvancedlithographyforsubmicrondevicesandVLSImicrolithographyNanoelectronicsandnanoprecisioninstrumentationTechnologyandapplicationsofmagneticmaterialsMolecularengineering:molecularmaterialsandself-assemblyprocessesDevicescoveredincludesemiconductordevices,optoelectronicdevices,micromachineddevices,nanodevicesandhybriddevices.Paperscoveringtheassociatedmaterials,physics,properties,fabricationandmanufacturingofthesedevicesarealsowelcomed.Journalhomepages:/locate/mejo